ESD damage in reticles used to be infrequent and easily detected. Now, due to the constantly shrinking feature sizes on reticles the damage mechanism has changed to a more subtle and continuous degradation mechanism -
EFM.
Microtome first characterized this unusual reticle damage mechanism in
2003 and we have recently quantified it through pioneering research in conjunction with the University of Colorado at Colorado Springs*.
EFM is the field-induced migration of chrome and it can change the CD of a reticle by more than 6nm per second. It is very difficult to detect and a damaged reticle can be used for weeks before the defective products it has printed start to fail in final inspection. By that time, the production pipeline is full of defective inventory, which can cost millions of dollars in lost output.
EFM can be prevented, but the traditional ESD prevention techniques currently used in fabs are not sufficient and some "best practices" that are intended to protect against ESD - such as grounding reticles through static dissipative supports during handling - actually make the risk of field induced damage
worse!
The most widely-used reticle SMIF pods and cassettes plus some of the most advanced pieces of reticle handling equipment in the industry adopt this grounding principle, but far from being protective as intended, they are inadvertently putting
your reticles at an increased risk of electrostatic damage!
Such is the poor state of understanding of this problem in the semiconductor industry today.